Requisition ID: R10173312- Category: Engineering
- Location: Linthicum, Maryland, United States of America
- Clearance Type: Polygraph
- Telecommute: No- Teleworking not available for this position
- Shift: 1st Shift (United States of America)
- Travel Required: Yes, 10 of the Time
- Relocation Assistance: Relocation assistance may be available
- Positions Available: 2
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact peoples lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nations history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, theyre making history. Are you interested in exploring a career on the cutting edge of next generation circuit design? Youll leverage your current experience and join our team of scientists and engineers in design of integrated circuits for emerging applications in low temperature environments. You’ll work in a fast-paced team environment alongside a broad array of scientists and engineers to make these design solutions a reality.
The Microelectronics Designs and Applications (MDA) Business Area (BA) of Northrop Grumman Mission Systems (NGMS) is seeking motivated engineers and physicists to join our research and development design team focused on custom, low-power, low-temperature, RF, quantum, analog and mixed signal ASICs. Selected candidates will work in Northrop Grumman’s Superconducting ASIC Design team supported by our local semiconductor foundry. Candidates will be expected to contribute to knowledge transfer of mastered design techniques and/or semiconductor manufacturing/testing experience, build upon task leadership and EM simulation skills, to develop novel circuits/design techniques/best practices, and to learn systems level skills to better communicate work with different teams. Selected candidates will work closely with design leadership, product owners, fabrication teams, test teams, and theory teams, to realize strong suites of experiments to further research and development on an aggressive design schedule. All work will be performed in a Linux environment using state of the art computer aided design tools. Candidates will be exposed to many different disciplines and will have the opportunity to grow skills in these multitude of directions of the candidate’s choosing. Staff engineers are expected to focus on one of two paths: Design Execution Leadership (DEL) or Subject Matter Expertise (SME).
What you can expect:
Learn/build upon superconducting, quantum, design, and RF EM simulation techniques. Lead ASIC chip designs to product owner specification. Would often require leading junior designers to complete this task. Document and present weekly reports on design task status. Continue to learn and develop in a unique and interesting environment. Contribute to knowledge transfer to invest in building up junior designers. Relied upon to complete designs in any situation regardless of complexity and deliverable date.
Design leadership tasks and responsibilities include:
Managing program-specific due dates and deliverables. Responsible for program related design organization. Responsible for assigning and managing chip leads. Responsible for organizing and maintaining program documentation and practices. Maintaining and improving communication inside of and out from design team. Setting up and chairing meetings for design progress. Responsible for setting up chip deadlines and design reviews. Maintaining seat as primary communication point between design team and external teams. Responsible for enforcing design best-practices and implementation of training and processes.
Design SME tasks and responsibilities include:
Work collaboratively with IPT leads and product lobbyists to address concepts for design issues and improve upon existing designs. Capable of providing technical support and directives for DELs. Deep understanding of technology and MDA BA’s goals to bring perspectives to DELs and unique and greatly detailed solutions to MDA BA. Critical understanding of design needs and capabilities to assist DELs in preventing scope creep. Expert in one or two mission critical areas and is the sole focus point for all considerations of this technology for many programs, DELs, and product lobbyists. Create, impalement, improve, and/or consult on all aspects of design team/tool improvement.
The right candidate will be comfortable in a dynamic environment with rapidly developing technologies and tools. The candidate must be comfortable with viewing previous designs to learn from and implement improvements as the MDA BA learns more about our developing technology. Successful candidates will be required to maintain an aggressive design schedule and contribute to work as a part of a team. This position will require candidates to work with product owners, design, fabrication, and test teams to assist in bringing impressive experiment ideas to reality. The most desirable candidates will be invested in continual learning and development of superconducting and quantum technologies and capabilities.
This position requires work on site in Northrop Grumman Baltimore, MD area facilities.
Sr. Principal IC Design Community of Practice Lead Engineer Basic Qualifications:
- BS in electrical engineering, computer engineering, physics, or a closely related field, with 12 or more years of experience, or MS degree with 10 years of experience, or PhD with 7 years of experience.
- Expert level attention to detail and organization.
- Expert level experience with Cadence Virtuoso or similar IC design software.
- Mastery of Linux infrastructure setup and PDK.
- Mastery of with 2D and 3D EM solving software such as ADS and HFSS.
- Expert problem solving, analytical, written, and oral communication skills.
- Mastery with collaborate with multiple team members and stakeholders to complete chip leadership tasks.
- Mastery with independently taking concepts and deriving action items to complete assigned tasks with minute guidance.
- Mastery of mentoring junior designers.
- Expert in identifying, providing, and owning long term and long-lasting solutions for gaps in the design team.
- Willing to lead large teams and/or multiple medium sized teams.
- Able to obtain and maintain TS/SCI Clearance with Polygraph. US Citizenship is a requirement for this.
- Willing to work full-time on site in Baltimore Maryland.
Preferred Qualifications:
- Expert level knowledge of the IC design flow including schematic capture, simulation, and layout.
- An interest in superconductivity and advanced computing technology.
- Mastery of Python.
- Mastery of semiconductor fabrication, testing, and/or novel idea creation.
- Mastery of small to medium size team leadership.
- Mastery of PDK coordination and Linux infrastructure setup and maintenance.
- Active TS/SCI Clearance with a Polygraph.
Our Values. The women and men of Northrop Grumman Corporation are guided by Our Values. They describe our company as we want it to be. We want our decisions and actions to demonstrate these Values. We believe that putting Our Values into practice creates long-term benefits for shareholders, customers, employees, suppliers, and the communities we serve.
Our Responsibility. At Northrop Grumman, we are committed to maintaining the highest of ethical standards, embracing diversity and inclusion, protecting the environment, and striving to be an ideal corporate citizen in the community and in the world.
NGMCENG
Salary Range: $157,500 - $236,300
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidates experience, education, skills and current spanet conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
