Job Description

• Design and Development: Develop and optimize mechanical packaging designs for semiconductor power electronic modules, ensuring they meet performance, reliability, and manufacturability requirements. Create definitions of parts, and assemblies in the form of 2D cross sections, 3D models, tolerance stack-ups, and various electronic data formats to support analysis, manufacturing, assembly, tooling, and inspection.
• Thermal Management: Design packaging solutions that effectively manage thermal loads to ensure the reliability and longevity of power modules.
• Material Selection: Select appropriate materials for packaging that meet thermal, mechanical, and electrical requirements.
• Configuration Management: Work closely with the Configuration Management team to ensure all design changes are accurately documented and tracked. Maintain up-to-date records of design revisions and ensure compliance with configuration management processes.
• Collaboration: Collaborate with electrical engineers, manufacturing teams, and suppliers to ensure seamless integration of packaging solutions into the overall product.
• Compliance: Ensure all packaging designs comply with industry standards and regulatory requirements.
• Documentation: Maintain detailed documentation of packaging designs, test results, design changes, and configuration management records.
• Continuous Improvement: Identify opportunities for process improvements and cost reductions in packaging design and manufacturing.
• Prototyping and Testing: Create prototypes and conduct rigorous testing to validate packaging designs. Analyze test data and make necessary design adjustments.
• Uses judgment and has ability to propose different solutions outside of set parameters to address more complicated manufacturing processes with technical variety and/or interdependent production cycles. Uses technical experience and analytical thinking. Uses multiple internal and limited external sources outside of own teams to arrive at decisions.
• Acts as a resource for colleagues with less experience. May lead small projects with low risks and resource requirements. Explains information; developing skills to bring team members to consensus around topics within field. Conveys performance expectations and may handle sensitive issues.

Basic Qualifications

• Bachelor’s degree or higher from an accredited university or college in Mechanical Engineering or a related field.
• Minimum of 2 years of experience in mechanical design
• Proficiency in CAD software, AutoCAD, SolidEdge, ANSYS Workbench
• Strong understanding of thermal management and mechanical stress analysis
• Knowledge of industry standards and regulatory requirements
• Familiarity with configuration management tools and processes

Preferred Qualifications

• Master’s degree or higher from an accredited university or college in Mechanical Engineering or a related field.
• 2-5 years of experience in mechanical design
• Experience in Aerospace industry.
• Experience in SiC/GaN power module design/packaging.
• Strong oral and written communication skills
• Demonstrated ability to analyze and resolve problems.
• Ability to document, plan, market, and execute programs
• Established project management skills
• Experience with power electronics and power module packaging
• Familiarity with reliability testing and failure analysis
• Experience working with configuration management systems
• Excellent problem-solving skills and attention to detail
• Strong communication and teamwork abilities